|
KMID : 0362419920300040481
|
|
Journal of Korean Academy of Prosthodontics
1992 Volume.30 No. 4 p.481 ~ p.492
|
|
|
EFFECTS OF SPUTTERED NON-PRECIOUS METALLIC THIN FILMS ON THE CHEMICAL BONING BETWEEN DENTAL ALLOY AND PORCELAIN
|
|
Cho Sung-Am
|
|
|
Abstract
|
|
|
Auther measured the bonding strength between Dental Porcelain and Nonprecious Dental Alloy and anlyzed diffusion Phenomena at the interfaceby by Auger electron spectroscopy and also Electron spectroscopy for Chemical Analysis. The each specimen was sputtered with Al, Cr, In and Sn.
1. Ni which is the main element of the matris of dental nonprecious alloy diffuse more than the other element and the Ni diffusion rate of each speciman was well coordinated with the bonding strength of each.
2. The Sn thin film suppress the diffusion rate of Ni of matrix into the Dental Porcelain than the In or Cr thin films.
3. The Al thin film suppress the diffusion rate of Ni than the Sn thin film.
4. The main coponent of dental porcelain : Al, Si, Mo diffused into the matrix of alloy.
It means that the each element of dental alloy and dental porelain diffused into the each other part.
|
|
|
KEYWORD
|
|
|
|
|
|
FullTexts / Linksout information
|
|
 
|
|
|
Listed journal information
|
|
 
|